The POU3500 method presents dynamic temperature Charge of the process chamber cathode / electrode / anode and will be synchronized with any etch procedure.
Tool & TCU software calibration techniques fluctuate exterior examination devices not employed frequently for verifying
The information down below is categorized by semiconductor system and Device company. Just about every desk consists of an Applications Matrix that demonstrates qulified and business procedures.
Originally founded in 1985, our company has grown into a recognized leader in giving temperature Manage units to the global semiconductor industry.
This amazing method, supplying a little type factor, low priced-of-possession and Dynamic Temperature Regulate made available process and tools engineers a fresh Software to enhance their temperature delicate procedures.
we're guided in our perception that prosperity During this aggressive sector stems from furnishing shoppers with remarkably engineered new items and environment class customer support.
All static TCUs demand excess cooling & heating capacities because of their very big system fluid reservoirs. the method fuid reservoir on LAUDA-Noah's dynamic temperature Command program is lower than one gallon.
Along with the POU3300, you are click here able to achieve unprecedented leads to etch overall performance, chamber uptime, decreased price of ownership and fab Area utilization – all while improving your approach reliability.
the info pertains to the 300mm chamber temperature profile during a high element ratio Etch procedure, operating at pretty higher RF power ailments (~three.8kW). The powerful aspects of this details established are:
LAUDA-Noah is Conference these new troubles and has incorporated Electrical power preserving engineering in units that are friendly into the ecosystem and have a low cost to work.
The TEs' can change directly from heating to cooling, or visa-versa. they are able to activate & off although inside the heating or cooling mode and will maximize or lower the level of heating or cooling devoid of switching in any respect.
a lot more than at any time, shrinking device geometries, demanding new procedures in addition to a hugely aggressive setting need temperature Command techniques that Merge quickly and correct temperature Handle with the emphasis on lessened running fees and enhanced dependability.
The reality is that accurate Dynamic Temperature Command can only be reached when all 5 (five) of the subsequent method structure and installation prerequisites are satisfied:
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